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unfilled resin System

Mould Covering Epoxy Resin HP-E25FB
Mould Covering System - Epoxy Resin | HP-E25FB
The Epoxy Resin System HP-E25FB is an unfilled, thixotropic 2-component combination of resin and hardener with high sanding anpolishing properties-

Mould covering system, 25 minutes working time
from 39,40 EUR
incl. 19% tax excl. Shipping costs
Epoxy resin multi-purpose system for laminating, gluing and many other applications
Epoxy Resin multi-purpose system 25 min (medium viscous) | HP-E25KL
The Epoxy-System HP-E25KL is an unfilled, medium-viscous, chemical resistant combination of resin and hardener with short working time (pot life). It is versatile for laminating and for bonding / gluing applications.

Bonding, Laminating, Mould making, Applicable from 5°C temperature
from 6,90 EUR
incl. 19% tax excl. Shipping costs
Multi-Purpose System Epoxy HP-E45KL
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Epoxy Resin multi-purpose system 45 min (medium viscous) | HP-E45KL

The Epoxy-System HP-E45KL is an unfilled, medium-viscous, chemical resistant combination of resin and hardener with working time (pot life) about 45 minutes. It is versatile for laminating and for bonding / gluing applications.

Bonding, Laminating, Mould Making

from 6,90 EUR
incl. 19% tax excl. Shipping costs
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