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Epoxy Mould Resin Systems

Mould Covering Epoxy Resin HP-E30FB
The Epoxy Resin System HP-E30FB is an aluminium-filled, high-viscosity combination of resin and hardener with high hardness.

Mould covering system, 30 minutes working time
from 28,90 EUR
incl. 19% tax excl. Shipping costs
Mould Covering Epoxy Resin HP-E25FB
The Epoxy Resin System HP-E25FB is an unfilled, thixotropic 2-component combination of resin and hardener with high sanding anpolishing properties-

Mould covering system, 25 minutes working time
from 39,40 EUR
incl. 19% tax excl. Shipping costs
Epoxy resin multi-purpose system for laminating, gluing and many other applications
The Epoxy-System HP-E25KL is an unfilled, medium-viscous, chemical resistant combination of resin and hardener with short working time (pot life). It is versatile for laminating and for bonding / gluing applications.

Bonding, Laminating, Mould making, Applicable from 5°C temperature
from 6,90 EUR
incl. 19% tax excl. Shipping costs
Multi-Purpose System Epoxy HP-E45KL

The Epoxy-System HP-E45KL is an unfilled, medium-viscous, chemical resistant combination of resin and hardener with working time (pot life) about 45 minutes. It is versatile for laminating and for bonding / gluing applications.

Bonding, Laminating, Mould Making

from 6,90 EUR
incl. 19% tax excl. Shipping costs
Mould Covering thixotropic  Epoxy Resin
  • High-quality mould covering resin
  • Non-drip, without run-off on vertical surfaces -high thixotropic, blue-grey coloured
  • Vacuum degassed
  • User friendly mixing ratios (100:10)
  • For abrasion-and breaking resistance surfaces with good thermal conductivity.
  • Innovative formulation, free of DETA1 with high styrene resistance.
from 29,90 EUR
incl. 19% tax excl. Shipping costs
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