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Mould Covering Epoxy Resin HP-E25FB
Mould Covering System - Epoxy Resin | HP-E25FB

Mould Covering System - Epoxy Resin | HP-E25FB

Product No.:
HP-E25FB
Shipping time:
ca. 1-3 days ca. 1-3 days (abroad may vary)
from 39,40 EUR

incl. 19% tax excl. Shipping costs

This product is compatible with (for example):

Nitril-gloves | HP-L1053
Size: 10
Norm: EN 388 4121
Colour: yellow
2,28 EUR
Stirring Rods | 1405
3 pieces of stirring rods made of wood for stirring of resin mixtures
  • Length 20 cm
  • Material wood
1,20 EUR
0,40 EUR per Spatula

This product is similar to:

Customers who bought this product bought also the following products:

HP-G Priming Wax for porous surfaces
  • HP-G wax primer for barely wettable and porous surfacesHighly effective
  • Flowable and silicon free wax
  • Foundation for Film Release Agent HP-PVA
  • Good release properties
  • Drying time approx. 5-15 minutes
from 13,50 EUR
Acetone cleaning and degreasing agent

Acetone is a solvent and is usually used to clean tools from resin, that has not yet dried completely. Furthermore it is often used for degreasing surfaces (e.g. fibre glass or carbon fibre).  

Cleaning and degreasing agent

from 9,90 EUR
Standard laminating Resin Epoxy HP-E55L

The Epoxy-System HP-E55L is an unfilled, low viscous, 2-component combination of resin and hardener with a processing time of 55 minutes.

These are low-priced standard laminating resins with good dimensional stability and impregnating behaviour.

from 5,50 EUR