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Mould Covering Epoxy Resin HP-E30FB
Mould Covering System, black - Epoxy Resin | HP-E30FB

Mould Covering System, black - Epoxy Resin | HP-E30FB

Product No.:
HP-E30FB
ca. 1-3 days ca. 1-3 days (abroad may vary)
from 28,90 EUR

incl. 19% tax excl. Shipping costs

This product is compatible with (for example):

This product is similar to:

Mould Release Agent for Epoxy and Polyester
  • Silicon free dispersion of wax in a dissolver mixture
  • Operating temperature up to 80°C
  • Sprayable, contains dissolver for epoxy and polyester resin
  • Suitable for smooth and dense undergrounds and in connection with the Film Release Agent HP-PVA
from 8,90 EUR

Customers who bought this product bought also the following products:

Heat stability Epoxy Resin HP-E120WSM

The Epoxy System HP-E120WSM is an unfilled, medium viscous, 2-component combination of resin and hardener. It can be used as a laminating resin system for a high temperature stabilities.

Mould and tool making, heat stability up to 150°C

from 15,90 EUR
104 g/m² Glass Fabric "Finish" Twill | HP-T100EF
Weight: 104 g/m²
Weave: Twill 2/2
Sizing: Finish 6224
Width: 127 cm

** New finish, with better impregnation properties! **
6,66 EUR