3D|CORE™ 10 mm XPS RHOMBUS | HP-3DXPS-RB-10
3D|CORE™ is a Structure Reinforcing Foam Core consisting of foam rhombus interconnected. Through this rhombus construction the plate is very flexible, which allows an even better drapability of the foam core.Material: XPS
Structure: Rhombus
Suitable for: epoxy resins
Technical data:
| Sheet size: | 1015 x 405 x 10 mm |
| Panel weight: | ca. 180 g |
| Resin comsuption surface: | approx. 200 g/m² per site |
| Resin comsuption structure: | approx. 90 g x mm x m² |
Areas of applications:
Automotive, aviation, rail, shipbuilding, industry, interior, sports and leisure, ...
Application areas:
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The general purpose for infusion core, especially for thinner laminates.
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Compatible with all regular solvent-free epoxy resins.
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Suitable for closed mould processes, including vacuum infusion (IMC/MTI®-Process), RTM-light and RTM-Heavy.
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Controlled and stable flow front
3D|CORE™ is a structure reinforcing foam core, which consists of hexagonal honeycombs, connected together by fine ribs. Through the honeycomb structure, the plate receives a great flexibility, which allows an excellent drapability of the foam core, and thus follows a contour.
The duct system acts as a perfect flow and venting aid during the filling of the material with resin. 3D|CORE™ is a SRF with closed pores. Thus, the material does not absorb fully with superfluous resin. Due to the simplicity of processing 3D|CORE™ improves production processes. So it not only saves time but also material. After curing of the resin the so formed bridges behave like hexagonal double T-beams. These connect the layers together so that forces introduced into the entire structure were optimally distributed. Thus, the technological properties in the area of shear, compressive and flexural strength are improved. In addition, buckling and delamination as well as sudden failure of the honeycomb is excluded. 3D|CORE™ is compatible with all resin systems and selectable in the appropriate foam system. It is the ideal lightweight foam core for your applications.
