Mould Release Agent | HP-BM17

Mould Release Agent | HP-BM17

HP-BM17 is a quick-drying Release Agent for the processing with epoxy and polyester resin. Silicon free dispersion of wax in a dissolver mixture.

Features and applications

• Sprayable, contains dissolver for epoxy and polyester resin
• Suitable for smooth and dense undergrounds and in connection with the Film Release Agent HP-PVA
• Operating temperature up to 80°C
• Economical in use
• Silicon free
• Long mould life-time
• Drying time approx. 15 min.

Processing guidelines

BM 17 is applied sparingly with a soft cotton cloth
(rotary motions). After a short drying time (approx.15 minutes)
the surface is polished with a dry and clean cotton cloth to a high gloss.
The mould is supposed to have an evenly gloss free from any streaks.

Prior to the first mould release, new moulds are preprocessed with three or five coatings of BM 17.
Every coating is supposed or be applied by using a different method, e.g.: from above to the bottom,
from the left to the right, rotary. After the mould release agent had been allowed to evaporate for several hours 
(over night is the best), the material should be polished again intensively.