Mould Release Agent | HP-BM17
HP-BM17 is a quick-drying Release Agent for the processing with epoxy and polyester resin. Silicon free dispersion of wax in a dissolver mixture.
Features and applications
- Sprayable, contains dissolver for epoxy and polyester resin
- Suitable for smooth and dense undergrounds and in connection with the Film Release Agent HP-PVA
- Operating temperature up to 80°C
- Economical in use
- Silicon free
- Long mould life-time
- Drying time approx. 15 min.
Processing guidelines
BM 17 is applied sparingly with a soft cotton cloth
(rotary motions). After a short drying time (approx.15 minutes)
the surface is polished with a dry and clean cotton cloth to a high gloss.
The mould is supposed to have an evenly gloss free from any streaks.
Prior to the first mould release, new moulds are preprocessed with three or five coatings of BM 17.
Every coating is supposed or be applied by using a different method, e.g.: from above to the bottom,
from the left to the right, rotary. After the mould release agent had been allowed to evaporate for several hours
(over night is the best), the material should be polished again intensively.
Technical Data Mould Release Agent HP-AC
- Form : liquid
- Colour : white
- Smell : characteristic
- Density : 0,78 g/ml (at 20°C, DIN 51757)
- Flash point : > 24 °C (EN ISO 2719)
- Viscosity : 8 sec. (flow cup 4mm, DIN EN ISO 2431)
Working notes and decision guidance
Below you will find processing information for epoxy resins, safety notes and also a decision guide for helping choosing the correct epoxy system.Decision guidance epoxy resins (PDF)
Decision support Release Agent (PDF)
If you need further working notes and decision guidance, you will find anything here in the download portal.
Hazard Statements
Mould Release Agent
H226 Flammable liquid and vapour.H304 May be fatal if swallowed and enters airways.
H336 May cause drowsiness or dizziness.
H412 Harmful to aquatic life with long lasting effects.
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